Home » Optoelectronics » Optoelectronic Packaging

Optoelectronic Packaging

We perform precision system integration and hermetic optoelectronic packaging processes in an ESD-safe cleanroom environment. Assembly operations include:

• Board-level assembly and testing
• Micro-optic system design
• Hermetic packaging qualified to space and MIL 883 standards
• Assembly of laser subsystems
• Fiber coupling and attachment
• Epoxy and eutectic solder diebonding
• Wirebonding
• Hermetic sealing with real-time in-line RGA analysis
• Solder assembly methods
• Low-outgas epoxy assembly
• Fusion splicing
• Bare and clad fiber handling